EENG 415/4105 - Integrated Circuit Fabrication: Materials and Processes (3 cr.)

Prerequisites

Description
Microfabrication techniques for silicon very large integrated circuits (VLSI), unit processes including lithography, native film growth, diffusion, ion implantation, thin film deposition and etching. Metal interconnects. Process integration for CMOS, BiCMOS, ECL and MEMS.

When Offered
Offered occasionally.