EENG 415 - Integrated Circuit Fabrication: Materials and Processes

Microfabrication techniques for silicon very large integrated circuits (VLSI), unit processes including lithography, native film growth, diffusion, ion implantation, thin film deposition and etching. Metal interconnects. Process integration for CMOS, BiCMOS, ECL and MEMS.
Prerequisites
Prerequisite: EENG 316.
When Offered
Offered occasionally.
(3 cr.)

AUC New Cairo Campus

AUC Tahrir Square Campus

New York

EENG 415 - Integrated Circuit Fabrication: Materials and Processes